Six-building foundry district
CAP-02
Advanced Semiconductor Fabrication
Specialty devices without a commodity process assumption.
Public record · CAP-02-001Assigned facilities5
Related programs1
Delivery modelIntegrated
Review basisEvidence gated
The Foundry & Integration Complex supports low-volume semiconductor and instrument programs whose substrates, geometries, temperatures, or operating environments fall outside standard production flows. Process integration, metrology, packaging, and qualification remain attached to one article genealogy.
Engagements are organized as bounded work packages with named evidence, review, and operating responsibilities. Public summaries do not identify sponsoring organizations.
What we do
Capability through operation.
- 01Process integration and module development
- 02Advanced lithography and nanoscale patterning
- 03Thin films, etch, implant, and surface preparation
- 04Materials characterization and failure analysis
- 05Advanced packaging and cryogenic electronics
Evidence
Current basis.
200 mm and specialty-substrate capability
Paired-article qualification under controlled divergence
Infrastructure